GK SDK 源码库: XMIPCLinuxV100R005C00SPC030 (kernel/tools/open_source excluded)

source/trusted-firmware/trusted-firmware-a-2.8/docs/design/alt-boot-flows.rst

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+Alternative Boot Flows
+======================
+
+EL3 payloads alternative boot flow
+----------------------------------
+
+On a pre-production system, the ability to execute arbitrary, bare-metal code at
+the highest exception level is required. It allows full, direct access to the
+hardware, for example to run silicon soak tests.
+
+Although it is possible to implement some baremetal secure firmware from
+scratch, this is a complex task on some platforms, depending on the level of
+configuration required to put the system in the expected state.
+
+Rather than booting a baremetal application, a possible compromise is to boot
+``EL3 payloads`` through TF-A instead. This is implemented as an alternative
+boot flow, where a modified BL2 boots an EL3 payload, instead of loading the
+other BL images and passing control to BL31. It reduces the complexity of
+developing EL3 baremetal code by:
+
+-  putting the system into a known architectural state;
+-  taking care of platform secure world initialization;
+-  loading the SCP_BL2 image if required by the platform.
+
+When booting an EL3 payload on Arm standard platforms, the configuration of the
+TrustZone controller is simplified such that only region 0 is enabled and is
+configured to permit secure access only. This gives full access to the whole
+DRAM to the EL3 payload.
+
+The system is left in the same state as when entering BL31 in the default boot
+flow. In particular:
+
+-  Running in EL3;
+-  Current state is AArch64;
+-  Little-endian data access;
+-  All exceptions disabled;
+-  MMU disabled;
+-  Caches disabled.
+
+.. _alt_boot_flows_el3_payload:
+
+Booting an EL3 payload
+~~~~~~~~~~~~~~~~~~~~~~
+
+The EL3 payload image is a standalone image and is not part of the FIP. It is
+not loaded by TF-A. Therefore, there are 2 possible scenarios:
+
+-  The EL3 payload may reside in non-volatile memory (NVM) and execute in
+   place. In this case, booting it is just a matter of specifying the right
+   address in NVM through ``EL3_PAYLOAD_BASE`` when building TF-A.
+
+-  The EL3 payload needs to be loaded in volatile memory (e.g. DRAM) at
+   run-time.
+
+To help in the latter scenario, the ``SPIN_ON_BL1_EXIT=1`` build option can be
+used. The infinite loop that it introduces in BL1 stops execution at the right
+moment for a debugger to take control of the target and load the payload (for
+example, over JTAG).
+
+It is expected that this loading method will work in most cases, as a debugger
+connection is usually available in a pre-production system. The user is free to
+use any other platform-specific mechanism to load the EL3 payload, though.
+
+
+Preloaded BL33 alternative boot flow
+------------------------------------
+
+Some platforms have the ability to preload BL33 into memory instead of relying
+on TF-A to load it. This may simplify packaging of the normal world code and
+improve performance in a development environment. When secure world cold boot
+is complete, TF-A simply jumps to a BL33 base address provided at build time.
+
+For this option to be used, the ``PRELOADED_BL33_BASE`` build option has to be
+used when compiling TF-A. For example, the following command will create a FIP
+without a BL33 and prepare to jump to a BL33 image loaded at address
+0x80000000:
+
+.. code:: shell
+
+    make PRELOADED_BL33_BASE=0x80000000 PLAT=fvp all fip
+
+--------------
+
+*Copyright (c) 2019, Arm Limited. All rights reserved.*